Abstract
Hole trapping in thermally grown silicon‐dioxide films has been studied using optically induced hot‐hole injection in p‐channel polysilicon‐SiO2‐silicon field‐effect‐transistor structures. Analysis of the data assuming a uniform trap distribution and no detrapping gives 3.1×10−13 cm2 and 1.4×1018 cm−3 for the capture cross section and the trap concentration, respectively. Initial hole‐trapping efficiency is almost 99% for a 1000‐Å SiO2 film.

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