Non-twinning deformation mechanism of pure copper under high speed electromagnetic forming
- 1 September 2015
- journal article
- Published by Elsevier in Materials & Design (1980-2015)
- Vol. 81, 54-58
- https://doi.org/10.1016/j.matdes.2015.05.023
Abstract
No abstract availableKeywords
Funding Information
- National Fundamental Research Program of China (2011CB012806, 2011CB012801)
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