On the mechanism of electroless plating. II. One mechanism for different reductants
- 1 May 1981
- journal article
- Published by Springer Nature in Journal of Applied Electrochemistry
- Vol. 11 (3), 395-400
- https://doi.org/10.1007/bf00613960
Abstract
No abstract availableKeywords
This publication has 24 references indexed in Scilit:
- The Electrochemistry of Electroless Deposition of CopperJournal of the Electrochemical Society, 1979
- Electroless copper plating from an iminodiacetate bathSurface Technology, 1976
- Some electrochemical aspects of the electroless nickel process with hypophosphiteElectrodeposition and Surface Treatment, 1975
- The Rate of Electroless Copper Depositionby Formaldehyde ReductionJournal of the Electrochemical Society, 1974
- Untersuchungen zur anodischen oxidation des hydrazins im alkalischen elektrolyten—I. Der reaktionsmechanismus an platinelektrodenElectrochimica Acta, 1973
- Electroless Deposition of Nickel-Boron Alloys Mechanism of Process, Structure, and Some Properties of DepositsJournal of the Electrochemical Society, 1973
- An Electrochemical Study of Electroless Gold-Deposition ReactionJournal of the Electrochemical Society, 1973
- Hydrolysis of the borohydride ion catalysed by metal–boron alloysJ. Chem. Soc. A, 1971
- Nickel plating on steel by chemical reductionJournal of Research of the National Bureau of Standards, 1946
- Der Mechanismus der Hypophosphitspaltung nach Versuchen mit Deuterium als IndicatorEuropean Journal of Organic Chemistry, 1942