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Publications
Microelectronics Packaging Handbook
Home
Publications
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook
RT
Rao R. Tummala
Rao R. Tummala
ER
Eugene J. Rymaszewski
Eugene J. Rymaszewski
YL
Y. C. Lee
Y. C. Lee
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1 September 1989
journal article
Published by
ASME International
in
Journal of Electronic Packaging
Vol. 111
(3)
,
241-242
https://doi.org/10.1115/1.3226540
Abstract
No abstract available
Keywords
MICROELECTRONIC PACKAGING
Cited by 112 articles