Phase Equilibria and Vapor Pressures of Pure Phosphorus and of the Indium/Phosphorus System and Their Implications Regarding Crystal Growth of InP

Abstract

A new heat‐transfer surface, i.e., a “dendritic” heat sink, is presented. The preparation of the dendrites by forming a “brush” of nickel powder on a surface with a magnet and plating them in place with electroless nickel to form a dendritic finned surface is described. It is shown that, in addition to increased heat‐transfer rates due to the compact heat‐transfer area, the unique characteristics of the cavities on a dendritic surface improve the boiling mode of heat‐transfer. Despite their small size, dendritic heat sinks in a FC88 cooling liquid can dissipate about 6W from the surface of a silicon chip at 45°C. The thermal performance of the dendritic structure and the reliability of the dendritic heat sinks are discussed.