DSC and TBA studies of the curing behavior of two dicy‐containing epoxy resins

Abstract

The curing behavior of two commercial dicy‐containing resins (I & II), both with recommended cures of 127°C/2 h, has been studied by differential scanning calorimetry (DSC), torsional braid analysis (TBA) and Fourier Transform infrared spectroscopy. Compositional analysis reveals that the two resins differ primarily in the amine/epoxy ratio and the nature of the main epoxy components. Factors contributing to the complex curing behavior observed with II are identified. Isothermal kinetic runs by DSC and TBA lead to estimates for the conversion at the gel point, and to results which suggest that the reactions of epoxy with amine and hydroxyl occur with similar activation energies and similar heats of reaction.