Stress-Relaxation Characteristics in Tension of High-Strength, High-Conductivity Copper and High Copper Alloy Wires
- 1 January 1974
- journal article
- Published by ASTM International in Journal of Testing and Evaluation
- Vol. 2 (1), 32-39
- https://doi.org/10.1520/jte10069j
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Evaluation of Solderless Wrapped Connections for Central Office UseBell System Technical Journal, 1959
- Stress Systems in the Solderless Wrapped Connection and Their PermanenceBell System Technical Journal, 1954