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Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System(TPMS)
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Publications
Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System(TPMS)
Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System(TPMS)
XW
Xiaojun Wang
Xiaojun Wang
ZW
Zhiguo Wu
Zhiguo Wu
SL
Sheng Liu
Sheng Liu
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5 January 2006
conference paper
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/icept.2005.1564701
Abstract
No abstract available
Cited by 1 article