Development of a sorbitol alkaline Cu–Sn plating bath and chemical, physical and morphological characterization of Cu–Sn films
- 22 October 2004
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 187 (2-3), 377-387
- https://doi.org/10.1016/j.surfcoat.2004.01.029
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Study of the influence of glycerol on the cathodic process of lead electrodeposition and on its morphologyJournal of Power Sources, 2001
- Effect of tartrate on the morphological characteristics of the copper–tin electrodeposits from a noncyanide acid bathJournal of Applied Electrochemistry, 2000
- Electrodeposition of iron fragile layer on nickel substrate with emphasis on iron powder productionJournal of Power Sources, 1998
- Chemical, physical and morphological characterization of the electrodeposited iron fragile layer on aluminium substrateJournal of Power Sources, 1997
- The effect of the additive glycerol on zinc electrodeposition on steelMetal Finishing, 1997
- Cu/Sn interfacial reactions: thin-film case versus bulk caseMaterials Chemistry and Physics, 1996
- Optical characterization of bismuth reversible electrodepositionJournal of Electroanalytical Chemistry, 1996
- In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnectsJournal of Applied Physics, 1995
- Cathodic process in copper-tin deposition from sulphate solutionsJournal of Applied Electrochemistry, 1994
- Autocatalytic Deposition of TinJournal of the Electrochemical Society, 1989