Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces
- 1 August 2002
- journal article
- Published by Elsevier in Materials Characterization
- Vol. 49 (1), 35-44
- https://doi.org/10.1016/s1044-5803(02)00285-1
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Compatibilization and properties of PBT/PU polymeric alloysPolymer, 2001
- The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 filmsThin Solid Films, 1995
- Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) ProcessesMRS Proceedings, 1994