Cu Contamination Effect in Oxynitride Gate Dielectrics
- 1 January 2001
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 148 (11), G627-G629
- https://doi.org/10.1149/1.1407834
Abstract
We have studied the effect of Cu contamination in oxynitride gate dielectrics. Compared to thermal SiO2SiO2 with a physical thickness of 3-5 nm, the oxynitride shows a much improved Cu contamination resistance. Furthermore, the Cu contamination resistance increases with increasing nitrogen content. The mechanism of improved gate dielectric resistance to Cu is due to the strong diffusion barrier properties of oxynitride as observed by secondary ion mass spectroscopy. © 2001 The Electrochemical Society. All rights reserved.Keywords
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