The High Temperature Deformation Properties of Gold and Thermocompression Bonding
- 1 December 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (4), 290-296
- https://doi.org/10.1109/tphp.1975.1135079
Abstract
No abstract availableKeywords
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