The origins of stress in thin nickel films
- 1 September 1972
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 12 (1), 71-74
- https://doi.org/10.1016/0040-6090(72)90396-3
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Diffusivity and Solubility of Si in the Al Metallization of Integrated CircuitsApplied Physics Letters, 1971
- Low Temperature Diffusion in Polycrystalline Thin-Film Gold–Nickel CouplesJournal of Vacuum Science and Technology, 1969
- Interdiffusion in Cu‐Ni, Co‐Ni, and Co‐CuPhysica Status Solidi (b), 1964