The lattice thermal conductivity of copper alloys: Effect of plastic deformation and annealing

Abstract

The thermal and electrical conductivities were measured and the lattice thermal conductivities were deduced of two copper alloys (Cu-0-4% As and Cu-32% Zn) after severe torsional deformation and after subsequent annealing. Deformation and annealing conditions were selected to allow comparison of these measurements with studies of the release of stored energy made by Clarebrough, Hargreaves, Loretto, and West. In the ease of arsenical copper the only observable change in lattice thermal conductivity is due to a removal of dislocations during the recrystallization stage. In the case of alpha-brass, the recovery phenomena are complex and not fully understood; annealing seems to remove dislocations, point defects, and probably also stacking faults. Dislocation densities deduced from the lattice thermal conductivity appear to be somewhat higher than those deduced from stored energy release and from changes in the density.