Adhesion of Electroformed Copper and Nickel to Plastic Laminates
- 1 January 1970
- journal article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 48 (1), 88-92
- https://doi.org/10.1080/00202967.1970.11870136
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- The Effect of Metallic Contamination on Electrodeposited Nickel: Part II—Appearance and Surface TopographyTransactions of the IMF, 1970
- Role of polymer oxidation in the adhesion of polyethylene to metalsJournal of Polymer Science Part A-1: Polymer Chemistry, 1969
- The Influence of Surface Chemistry on the Adhesion of Copper Deposited on Plastic SubstratesTransactions of the IMF, 1969
- Mechanism of Bonding Electroless Metal to Organic SubstratesJournal of the Electrochemical Society, 1969
- The Adhesion of Electroless Metal Deposits to A B S and other PolymersTransactions of the IMF, 1968
- FINAL STRENGTH OF ADHINTSPublished by Elsevier ,1968
- Safety Devices or Motor Skills?Perceptual and Motor Skills, 1964