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A new architecture for packaging wideband communication equipment using a 3-D, orthogonal edge-to-edge topology
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Publications
A new architecture for packaging wideband communication equipment using a 3-D, orthogonal edge-to-edge topology
A new architecture for packaging wideband communication equipment using a 3-D, orthogonal edge-to-edge topology
DW
D.K. Wilson
D.K. Wilson
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6 January 2003
conference paper
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/glocom.1988.25877
Abstract
No abstract available
Keywords
WIDEBAND
EQUIPMENT
ORTHOGONAL
NEW ARCHITECTURE
EDGE TOPOLOGY
ARCHITECTURE FOR PACKAGING
Cited by 16 articles