Microwave dielectric constant of a low temperature co-fired ceramic

Abstract

Evaluation of low-temperature, co-fired ceramic multilayer packaging material at microwave frequencies has revealed a lower dielectric constant than the standard measurement at 1 MHz. Examination of resonance comparisons in previously published works suggests similar conclusions. Measurements using various resonators produced results in agreement with the derivations from other indirect methods. Time-domain network measurements on microstrip structures designed with the 1-MHz dielectric constant and on revised structures using the newly measured dielectric constant are in agreement with the newly measured values. A functional three-dimensional test structure is described.