Three-dimensional numerical optimization of a manifold microchannel heat sink
- 1 April 2003
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 46 (9), 1553-1562
- https://doi.org/10.1016/s0017-9310(02)00443-x
Abstract
No abstract availableKeywords
Funding Information
- Korea Institute of S&T Evaluation and Planning (2-578)
- Ministry of Education
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- Manifold microchannel heat sinks: isothermal analysisIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981