Fabrication and Evaluation of Three-Dimensional Optically Coupled Common Memory

Abstract

A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 µ m complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.