Microstructural Observations and Mechanical Behavior of Pb-Sn Solder on Copper Plates
- 1 January 1986
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Observations of Precipitates In 95PB-5SN SolderProceedings, annual meeting, Electron Microscopy Society of America, 1985
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- Fatigue Behavior of Solders Used in Flip-Chip TechnologyJournal of Testing and Evaluation, 1973
- On the Growth of Alloy Layer between Solid Copper and Liquid TinTransactions of the Japan Institute of Metals, 1972