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Reduction of Electromigration in Aluminum Films by Copper Doping
Home
Publications
Reduction of Electromigration in Aluminum Films by Copper Doping
Reduction of Electromigration in Aluminum Films by Copper Doping
IA
I. Ames
I. Ames
FD
F. M. D'Heurle
F. M. D'Heurle
RH
R. E. Horstmann
R. E. Horstmann
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1 July 1970
journal article
Published by
IBM
in
IBM Journal of Research and Development
Vol. 14
(4)
,
461-463
https://doi.org/10.1147/rd.144.0461
Abstract
No abstract available
Cited by 266 articles