Auger examination of contaminants in thin−film metallizations

Abstract

Gold nichrome metallizations vacuum evaporated at (10−6 Torr) have been examined with Auger electron spectroscopy and argon ion sputtering techniques. The primary contaminants within the films were carbon and oxygen, which were concentrated in the underlying nichrome film. The contaminants were believed to be due to residual gases present during evaporation. The significance of these results for eutectic bonding processes is discussed.