Wear of Gold Electrodeposits: Effect of Substrate and of Nickel Underplate
- 1 February 1979
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Bell System Technical Journal
- Vol. 58 (2), 323-349
- https://doi.org/10.1002/j.1538-7305.1979.tb02223.x
Abstract
The adhesive and abrasive wear of electrodeposited gold was studied and the effect of a ductile hard underplate (nickel) and a hard substrate (beryllium copper) determined. Wearing conditions experienced by connector contacts were modeled with rider-...Keywords
This publication has 6 references indexed in Scilit:
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- Wear of Gold Plate: Effect of Surface Films and Polymer CodepositsIEEE Transactions on Parts, Hybrids, and Packaging, 1974
- Tribological Properties of Gold for Electric ContactsIEEE Transactions on Parts, Hybrids, and Packaging, 1973
- Stages in the Wear of a Prow-Forming MetalA S L E Transactions, 1970
- The Wear of Electrodeposited GoldA S L E Transactions, 1968
- The lubrication of goldWear, 1963