Principles and applications of trans-wafer processing using a 2-μm thulium fiber laser
- 3 October 2015
- journal article
- Published by Springer Nature in The International Journal of Advanced Manufacturing Technology
- Vol. 84 (9-12), 2567-2578
- https://doi.org/10.1007/s00170-015-7870-z
Abstract
No abstract availableKeywords
This publication has 29 references indexed in Scilit:
- Confined micro-explosion induced by ultrashort laser pulse at SiO2/Si interfaceApplied Physics A, 2013
- Excimer laser doping using highly doped silicon nanoparticlesPhysica Status Solidi (a), 2013
- Laser-Induced Resistance Fine Tuning of Integrated Polysilicon Thin-Film ResistorsIEEE Transactions on Electron Devices, 2010
- Laser-induced damage threshold of silicon in millisecond, nanosecond, and picosecond regimesJournal of Applied Physics, 2010
- Ultraviolet femtosecond, picosecond and nanosecond laser microstructuring of silicon: structural and optical propertiesApplied Optics, 2008
- Advanced Dicing Technology for Semiconductor Wafer—Stealth DicingIEEE Transactions on Semiconductor Manufacturing, 2007
- Ablation and cutting of planar silicon devices using femtosecond laser pulsesApplied Physics A, 2003
- Free-form laser consolidation for producing metallurgically sound and functional componentsJournal of Laser Applications, 2000
- Laser induced damage in GaAs at 1.06 μm wavelength: surface effectsOptics & Laser Technology, 1996
- Laser Processing of SemiconductorsPublished by Elsevier ,1983