Effects of Sb, Sn, As, and P additions on the high-temperature ductility of Ni
- 30 April 1982
- journal article
- Published by Elsevier in Scripta Metallurgica
- Vol. 16 (4), 461-466
- https://doi.org/10.1016/0036-9748(82)90173-9
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A model for creep cracking by diffusion-controlled void growthMaterials Science and Engineering, 1981
- Reversible Temper EmbrittlementAnnual Review of Materials Science, 1977