A Rapid And Selective Anodic Bonding Method
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 277-280
- https://doi.org/10.1109/sensor.1995.717171
Abstract
A new anodic bonding technique suitable for dynamical microstructure fabrication has been developed, which shortens production time, enhances bonding reliability and yield rate, as well as improves temperature characteristics of devices. This method comprises the following two techniques. (1) A built-in mesh bias electrode on the glass layer to enhance the electric field for faster anodic bonding. (2) A built-in ground electrode on the glass layer, which controls capacitive electrode potential to prevent a movable electrode in the Si layer from sticking.Keywords
This publication has 2 references indexed in Scilit:
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