The dramatic increase in density of circuits on silicon chips has important and far-reaching implications for the design process, reliability, power, cost, manufacturing, and nature and functions of end products, based on LSI technologies. Today, 250 microinch (6μm) geometries are common; 150 microinch (4μm) geometries are in current commercial use. In the next ten years, LSI could be based on 25-60 microinch (0.6 - 1.5μm) geometries. Why, Wherein lies the value of such technologies? How will these technologies affect end products, the manner in which the products are designed, manufactured and tested, and the way people will use them?