The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys
- 1 June 1991
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science
- Vol. 26 (12), 3223-3234
- https://doi.org/10.1007/bf01124666
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Oxidation Behavior of Silver‐ and Copper‐Based Brazing Filler Metals for Silicon Nitride/Metal JointsJournal of the American Ceramic Society, 1989
- Study on bonding of heat-resisting fine creamics (Report8). Kinetics of the growth of reaction layer at the bonding interface of Si3N4 to metal joints.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1989
- Joining Joining of silicon nitride with Al-Cu alloysJournal of Materials Science, 1987
- Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloyJournal of Materials Science, 1987
- Joining of silicon nitride using amorphous Cu-Ti filler metal.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1986
- The wetting of alumina and vitreous carbon by copper-tin-titanium alloysJournal of Materials Science, 1978
- The wetting of carbon and carbides by copper alloysJournal of Materials Science, 1973
- The adhesion of metal/alumina interfacesJournal of Materials Science, 1968
- Interface Reactions Between Metals and Ceramics: Refractory Metals–Fused SiO2 SystemJournal of the American Ceramic Society, 1962
- Metal‐Ceramic Interactions: III, Surface Tension and Wettability of Metal‐Ceramic SystemsJournal of the American Ceramic Society, 1954