Comparison of Wafer Scale Integration with VLSI Packaging Approaches
- 1 June 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (2), 184-189
- https://doi.org/10.1109/tchmt.1987.1134736
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- A figure of merit for IC packagingIEEE Journal of Solid-State Circuits, 1978