Abstract
Resistance changes associated with precipitation in Al–Cu thin films were monitored during power annealing at current densities up to 4×106 A/cm2 and temperatures of ∼178 and 200 °C. The rate of change of resistance decreased as the current increased. It is argued that this decrease is due to the current inhibiting the precipitation of θ Al2Cu.

This publication has 12 references indexed in Scilit: