The role of pH and Cu(II) concentration in the electrodeposition of Cu(II) in NH4Cl solutions
- 24 January 1996
- journal article
- Published by Elsevier in Journal of Electroanalytical Chemistry
- Vol. 401 (1-2), 171-182
- https://doi.org/10.1016/0022-0728(95)04278-4
Abstract
No abstract availableKeywords
This publication has 24 references indexed in Scilit:
- The Dissolution Behavior of Silver in Ammoniacal Solutions with Cupric AmmineJournal of the Electrochemical Society, 1994
- Electroless Copper Plating from Copper‐Glycerin Complex SolutionJournal of the Electrochemical Society, 1992
- Electrocrystallization - theory and applicationsHydrometallurgy, 1992
- Mechanism of Hypophosphite‐Reduced Electroless Copper PlatingJournal of the Electrochemical Society, 1989
- The Determination of Ammonia in Copper Pyrophosphate Plating SolutionJournal of the Electrochemical Society, 1984
- The Effect of Some Additives on Electroless Copper DepositionJournal of the Electrochemical Society, 1983
- The Determination of Nitrite Ion in Copper Pyrophosphate Plating SolutionJournal of the Electrochemical Society, 1983
- Reactions of Scratched Copper Electrodes in Aqueous SolutionsJournal of the Electrochemical Society, 1981
- The Influence of the Anion on Copper ElectrocrystallizationJournal of the Electrochemical Society, 1981
- On the Mechanism of Electrodeposition in the Dimercaptothiadiazole/Copper Pyrophosphate SystemJournal of the Electrochemical Society, 1981