A method for preparing and bonding ultrasonic transducers used in high frequency digital delay lines

1 January 1968

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE

Vol. 56 (8), 1375-1376
https://doi.org/10.1109/PROC.1968.6597

Abstract

Cold-welding indium layers deposited on metal films constitutes a bonding method for the transducers of ultrasonic delay lines suitable for operation at bit rates beyond 100 MHz. This method permits the use of transducer materials with high coupling factor, resulting in delay lines with comparatively low insertion loss.

Keywords

BONDING
ULTRASONIC TRANSDUCERS
FREQUENCY
DELAY LINES
INDIUM
IMPEDANCE
BIT RATE
INSERTION LOSS
ACOUSTIC TRANSDUCERS
ELECTRODES

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