The contact resistance and reliability of anisotropically conductive film (ACF)
- 1 May 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Advanced Packaging
- Vol. 22 (2), 166-173
- https://doi.org/10.1109/6040.763188
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Development of Flip‐chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*Circuit World, 1996
- Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substratesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Development of an anisotropic conductive adhesive film (ACAF) from epoxy resinsJournal of Applied Polymer Science, 1995
- Modeling joining materials for microelectronics packagingIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Reliability assessment of isotropically conductive adhesive joints in surface mount applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Joining of displays using thermosetting anisotropically conductive adhesivesJournal of Electronics Manufacturing, 1993