Two of the CMOS device constraints at low temperatures have been identified, namely, the transconductance and the breakdown voltage roll-off. In the short channel devices, the transconductance first increases then decreases with the decreasing temperature. This transconductance roll-off phenomenon is likely caused by the parasitic series resistance in the source and drain regions. The breakdown voltage of the MOSFET's due to the parasitic bipolar transistor action decreases with the decreasing temperature, which is caused by the increase of the impact ionization rate at low temperatures.