Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement
- 1 June 1996
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 39 (9), 1883-1897
- https://doi.org/10.1016/0017-9310(95)00271-5
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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