Thermal stability of copper nitride films prepared by rf magnetron sputtering
- 1 July 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 325 (1-2), 55-59
- https://doi.org/10.1016/s0040-6090(98)00448-9
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Copper nitride thin films prepared by radio-frequency reactive sputteringJournal of Applied Physics, 1995
- Deposition of crystalline binary nitride films of tin, copper, and nickel by reactive sputteringJournal of Vacuum Science & Technology A, 1993
- Covalent Nitrides for Maskless Laser Writing of Microscopic Metal LinesMRS Proceedings, 1992
- Cu3N Thin Film for a New Light Recording MediaJapanese Journal of Applied Physics, 1990
- Heteroepitaxial growth of Cu3N thin filmsJournal of Crystal Growth, 1989