Electromigration Damage of Grain-Boundary Triple Points in Al Thin Films
- 1 February 1971
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 42 (2), 880-882
- https://doi.org/10.1063/1.1660116
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- Motion of Inclusion Induced by a Direct Current and a Temperature GradientJournal of Applied Physics, 1970
- VALUE D0Z* FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMSApplied Physics Letters, 1970
- Surface topology changes during electromigration in metallic thin film stripesThin Solid Films, 1969
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969
- Electromigration in Thin Al FilmsJournal of Applied Physics, 1969
- RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMSApplied Physics Letters, 1968
- DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMSApplied Physics Letters, 1967