Fatigue of Solder Joints in Surface Mount Devices
- 1 January 1988
- book chapter
- Published by ASTM International
- p. 588-610
- https://doi.org/10.1520/stp24508s
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- A study of creep crack growth in 2219-T851 Aluminum Alloy Using a Computerized Testing SystemMetallurgical Transactions A, 1984
- Mechanisms of creep-fatigue interactionMetallurgical Transactions A, 1982
- Wedge type creep damage in low cycle fatigueMetallurgical Transactions A, 1982
- Effect of Environment on Fatigue and Creep Crack Growth in Inconel X-750 at Elevated TemperatureMetallurgical Transactions A, 1982
- Diffusion and deformation controlled creep crack growthMetallurgical Transactions A, 1980
- SuperplasticityPublished by Springer Nature ,1980
- Intergranular fracture during power-law creepActa Metallurgica, 1979
- The stress dependence of the crack growth rate during creepInternational Journal of Fracture, 1977
- A model for creep fracture based on the plastic growth of cavities at the tips of grain boundary wedge cracksActa Metallurgica, 1977
- Intergranular fracture at elevated temperatureActa Metallurgica, 1975