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Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
Home
Publications
Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
AB
A. J. Blodgett
A. J. Blodgett
DB
D. R. Barbour
D. R. Barbour
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1 January 1982
journal article
Published by
IBM
in
IBM Journal of Research and Development
Vol. 26
(1)
,
30-36
https://doi.org/10.1147/rd.261.0030
Abstract
No abstract available
Cited by 157 articles