A Low-stress Trench Isolation Structure And Its Electrical Characteristics Of Sub 20 Ps High-speed ECL
- 1 January 1993
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- A new interlayer formation technology for completely planarized multilevel interconnection by using LPDPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990