Thermal expansion of reference materials: copper, silica and silicon
- 15 November 1973
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 6 (17), 2070-2078
- https://doi.org/10.1088/0022-3727/6/17/313
Abstract
Between 30 and 290 K the thermal expansion of vitreous silica is shown to be particularly sensitive to thermal history. Values given for the linear coefficient α were determined relative to copper, and existing reference data for copper are discussed. α for silicon has also been measured relative to copper from 55 K to room temperature. Values of α at 283 K are reported for a number of samples of copper, and for Ag, Au, Al, Pt, Pd, MgO, NaCl and CaF2.Keywords
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