Microanalysis of Copper-Tin Phases in Dental Amalgam

Abstract

An etch resistance phase was found in dental silver amalgam when the amalgam was examined metallographically. This phase was common to the silver alloy ingot as well as to its prepared amalgam. Qualitative electron microprobe technics were used to identify this phase. Quantitative electron microprobe analysis defined it as the η' phase of the copper-tin system or the intermetallic compound Cu₆Sn ₅.