Thermal Characteristics of 16- and 40-Pin Plastic DIP's
- 1 December 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (4), 455-461
- https://doi.org/10.1109/tchmt.1981.1135833
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A Recommendation of Thermal Measurement Techniques for IC Chips and Packages8th Reliability Physics Symposium, 1977
- The Analysis of Data from Accelerated Stress Tests8th Reliability Physics Symposium, 1971
- Intermetallic formation in gold-aluminum systemsSolid-State Electronics, 1970