Effect of Bromine in Molding Compounds on Gold - Aluminum Bonds
- 1 December 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (4), 379-385
- https://doi.org/10.1109/tchmt.1986.1136687
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Wire Bond Integrity Test ChipPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1983
- Do flame retardants affect the reliability of molded plastic packages?Microelectronics Reliability, 1981