Grain Boundary Diffusion of Zinc in Copper

Abstract

In continuation of a previous study of grain boundary diffusion of silver in copper the grain boundary diffusion of zinc along grain boundaries of columnar copper has been investigated at various temperatures. The results confirm the influence of the angle between the grains on diffusion and indicate an angular dependence of the activation energy. The latter reaches very small or even negative values in a certain range of orientation in agreement with the proposed model.