Advanced Copper/Polyimide Hybrid Technology
- 1 September 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (3), 425-432
- https://doi.org/10.1109/tchmt.1987.1134744
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Thermal and Physical Properties and Etching Characteristics of PI FilmsJournal of the Electrochemical Society, 1985