Elimination of Fractures in Plated-Through-Hole Printed Circuit Boards by the Use of Ductile Plating
- 1 December 1966
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Materials and Packaging
- Vol. 2 (4), 107-109
- https://doi.org/10.1109/tpmp.1966.1135564