High-gain submillimeter-wave mHEMT amplifier MMICs
- 1 May 2010
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
A compact H-band (220-325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) amplifier has been developed, based on a grounded coplanar waveguide (GCPW) technology utilizing 50 nm and 35 nm metamorphic high electron mobility transistors (mHEMTs). By applying the 35 nm gate-length process, a four-stage cascode amplifier circuit achieved a small-signal gain of 26 dB at 320 GHz and more than 20 dB in the bandwidth from 220 to 320 GHz. Based on the 50 nm mHEMT technology, the same amplifier design demonstrated a linear gain of 19.5 dB at 320 GHz and more than 15 dB between 240 and 320 GHz. Coplanar topology in combination with cascode transistors resulted in a very compact die size of only 0.6 mm 2 . For low-loss packaging of the circuit, a set of waveguide-to-microstrip transitions has been realized on 50 μm thick GaAs and quartz substrates demonstrating an insertion loss S 21 of less than 2 dB and 1.25 dB at 320 GHz, respectively. Finally, successful mounting and packaging of the amplifier chip into an H-band waveguide module was accomplished with only minor reduction in performance.Keywords
This publication has 6 references indexed in Scilit:
- A 300 GHz mHEMT amplifier modulePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2009
- A Submillimeter-Wave HEMT Amplifier Module With Integrated Waveguide Transitions Operating Above 300 GHzIEEE Transactions on Microwave Theory and Techniques, 2008
- 35 nm metamorphic HEMT MMIC technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2008
- Submillimeter-Wave InP MMIC Amplifiers From 300–345 GHzIEEE Microwave and Wireless Components Letters, 2008
- Demonstration of a S-MMIC LNA with 16-dB Gain at 340-GHzPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007
- Sub 50 nm InP HEMT Device with Fmax Greater than 1 THzPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007