Quantitative auger electron analysis of titanium nitrides
- 1 January 1985
- journal article
- Published by Elsevier BV in Surface Science
- Vol. 149 (1), 105-118
- https://doi.org/10.1016/s0039-6028(85)80016-9
Abstract
No abstract availableKeywords
This publication has 21 references indexed in Scilit:
- Applications of TiN thin films in silicon device technologyThin Solid Films, 1982
- TiN formed by evaporation as a diffusion barrier between Al and SiJournal of Vacuum Science and Technology, 1982
- Auger and x-ray characterization of surface nitride films on Ti, Zr, and HfJournal of Vacuum Science and Technology, 1982
- TiN coatings on steelThin Solid Films, 1981
- Microhardness of TiNx coatings obtained by reactive cathodic sputteringThin Solid Films, 1981
- Thermal stability of titanium nitride for shallow junction solar cell contactsJournal of Applied Physics, 1981
- Titanium nitride film as a protective coating for a vacuum deposition chamberThin Solid Films, 1979
- Matrix effects in quantitative auger analysis of dilute alloysSurface Science, 1979
- Quantitative auger electron analysis of homogeneous binary alloys: Chromium in goldSurface Science, 1977
- Preparation, Composition and Solid State Investigations of TiN, ZrN, NbN and Compounds from the Pseudobinary Systems NbN-NbC, NbN-TiC and NbN-TiN.Acta Chemica Scandinavica, 1977