Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique
- 1 May 2008
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 201 (1-3), 531-535
- https://doi.org/10.1016/j.jmatprotec.2007.11.220
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Effect of ultrasonic surface finishing on the strength and thermal shock behavior of the EDMed ceramic compositeInternational Journal of Machine Tools and Manufacture, 2002
- Fundamental study of ultrasonic polishing of mold steelInternational Journal of Machine Tools and Manufacture, 2002
- Ultrasonic flow polishingUltrasonics, 1998